In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore's Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore's Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
Marvell's Vision – Custom Silicon, CXL, DPUs, Ethernet, Optical
State-Of-The-Art of Advanced Packaging
CXL Is Dead In The AI Era
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Packaging options and advances for digital ICs
Challenges and recent prospectives of 3D heterogeneous integration
Hybrid Bonding Process Flow - Advanced Packaging Part 5
John Rogers Soft Materials, Bio-integrated Stretchable
Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of
Advanced Packaging Design for Heterogeneous Integration
Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan
PDF) 3-D Hyperintegration and Packaging Technologies for Micro
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2310.11651] US Microelectronics Packaging Ecosystem: Challenges