Chip Bonding - an overview
Thermal copper pillar bump - Wikipedia
Electronics, Free Full-Text
Levels and Steps of Integration. Introduction, by Suny Li
Basics of chip/package codesign in a large flipchip application
SEM image of a cross section of an unstressed 30 μm solder bump
Cross-section of solder bump (a) and package structure of flip
Ball grid array patented technology retrieval search results
Schematic of the chip/bump build-up cross-section.
Polymers in Electronic Packaging: Semiconductor Substrates for
a) Schematic of 3-D stack package. (b) Cross section of 3-D stack
Faraday Technology Corporation-Flip-Chip Package
Schematic of the chip/bump build-up cross-section.
Microscopy Solutions for Advanced Semiconductor Packaging
Cross-section of solder microbump on the Si chip (not in scale) (a